Time resolved FT-EIS for Cu- UPD and BD (and stripping) on Au. Deposition and stripping of Cu are controlled by voltammetry.

(A) Linear voltage sweep at 6 mV/s from 0.5 V to -0.3 V to 0.5 V. UPD peak occurs at ~ 0.0 V, and BD peak occurs  at ~  -0.2 V. Frames are repeated continuously.

(C) Au electrode in 0.6 mM Cu 2+  + 0.05 M NaClO4

(B) Au electrode in 0.05 M NaClO4