Time resolved FT-EIS for Cu-UPD and BD (and stripping) on Au. Deposition and stripping of Cu are controlled by voltammetry.
(A) Linear voltage
sweep at
6 mV/s from 0.5 V to -0.3 V to 0.5 V. UPD
peak occurs
at ~ 0.0 V, and BD peak occurs at
~ -0.2 V. Frames are repeated continuously.
(B) Au electrode in 0.05 M NaClO4
(C) Au electrode in
0.6 mM Cu 2+ + 0.05 M NaClO4