PUBLICATIONS

Selected Publications

1. Abdallah, Dalia; Li, Yuzhuo; Shipp, Devon A., Photoresponsive Lamellar Structures Utilizing Azobenzene Modified Surfactants, PMSE preprints (2007), 96, 146-147
2. Microelectronic Applications Using Chemical Mechanical Planarization, Edited by Yuzhuo Li, Publisher: John Wiley & Sons, 2007
3. Junzi Zhao, Ping Wu, Chris Brancewicz, Yuzhuo Li, A Liposome Containing Slurry for Tungsten Chemical Mechanical Polishing, Journal of Tthe Electrochemical Society, Volume 154, Issue 3, pp. H225-230 (2007)
4. Fadwa Odeh, Nicole Heldt, Michele Gauger, Gregory Slack, Yuzhuo Li, PFG-NMR Investigation of Liposome Systems Containing Hydrotrope, Journal of Dispersion Science & Technology, Volume 27, Number 5, 2006.
5. Yuzhuo Li and Fadwa Odeh, Characterization of Pharmaceutical Dispersion Using Various Particle Sizing Techniques, American Pharmaceutical Review. Volume 9, Issue 3, 2006, pp 94-99.
6. Ying Li, Junzi Zhao, Ping Wu, Yong Lin, S.V. Babu and Yuzhuo Li, Interaction between abrasive particles and films during chemical-mechanical polishing of copper and tantalum, Thin Solid Films, Volume 497, Issues 1-2, 21 February 2006, Pages 321-328.
7. Y. Li, J. Keleher, T. Zhang, D. Shipp, and S. Hellring, Reactive Pads for Metal CMP, Proceedings of Twenty Second International VLSI/ULSI Multilevel Interconnection Conference, Fremont, CA. 2005, pp 245-239.
8. Abeer Al Bawab, Nicole Heldt, and Yuzhuo Li, Emulsified Orange Oil in an Aqueous Vesicle Solution, Journal of Dispersion Science and Technology, Volume 26, Number 2 / 2005, Pages:  251 – 256.
9. F. Odeh, K. Cheemalapati, V.R. Duvvuru, D.K. Bundi, S. Dhane and Y. Li, Chemical Analysis of Copper CMP Slurries Before and After Polishing for Defect Reduction, Proceedings of Tenth International C.M.P. for ULSI Multilevel Interconnection Conference, Fremont, CA. 2005, pp 53-57.
10. J. Zhao, D.K. Bundi, K. Cheemalapati, V.R. Duvvuru and Y. Li, A Non-BTA Based Novel Post CMP Clean Solution, Proceedings of Tenth International C.M.P. for ULSI Multilevel Interconnection Conference, Fremont, CA. 2005, pp 239-243.
11. S.K. Govindaswamy, F. Odeh, S. Dhane and Y. Li, Competitive Surface Adsorption of Key Chemicals on Abrasive Particles in Copper CMP Slurry, Proceedings of Tenth International C.M.P. for ULSI Multilevel Interconnection Conference, Fremont, CA. 2005, pp 292-299.
12. K. Cheemalapati, A. Chowdhury, V. Duvvuru, Yong Lin, Kwok Tang, Guomin Bian, Lily Yao, Yuzhuo Li, Novel Pure Organic Particles for Copper CMP at Low Down Force, MRS Bulletin, 2005.

Total List of Publications

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Last updated: 11/30/2007 20:24:05 -0500