Laboratory for Advanced Surface Planarization (LASP)

 
 

PRESENTATIONS

Selected Presentations

  1. Surface Adsorption Behaviors in CMP, Anji Microelectronics, Shanghai, China, June 5, 2006.
  2. Colloidal Systems in Chemical Mechanical Planarization of Semiconductor Wafers, Institutes of Chemistry, Chinese Academy of Sciences, Beijing, China, June 1, 2006.
  3. Novel Polymers for Applications in Chemical Mechanical Planarization of Semiconductor Wafers, 4th East Asia Conference on Polymers, Tianjin, China, May 29, 2006.
  4. Jay Giblin and Yuzhuo Li, Photoelectrochemical Behavior of Ag particles on TiO2, CAMP Annual Technical Meeting, Canandaigua, NY, May 18, 2006.
  5. Christine Nelson, Dalia Abdulla, and Yuzhuo Li, Synthesis and Characterization of Micro-gas Bubbles for Ultrasound Imaging, Particles 2006, Orlando, FL, May 14, 2006.
  6. Correlation between pad design and properties and copper CMP performance, Yuzhuo Li, Krishnayya Cheemalapati, Watanabe Jun, Ichiro Kodaka, Hattori Atsushi, Kobayashi Toshihiro, and Ken Hozumi, SEMICON Europa CMP Symposium, Munich, Germany, April 7, 2006.
  7. Investigation of Edge Over Erosion During Copper CMP, SEMICON China 2006, Shanghai, China, March 23, 2006.
  8. Investigation of Some Key Factors That Influence Step Height Reduction Efficiency and Defectivity During Metal CMP, Eleventh CMP-MIC, Fremont, CA, February 21-23, 2006.
  9. Key Factors that Influence Step Height Reduction Efficiency and Defectivity during Metal CMP, Levitronix CMP Users Conference, Santa Clara, CA, February 16, 2006.
  10. CMP Consumable Research at Clarkson University, Ebara, Tokyo, Japan, December 21, 2005.
  11. Y. Li, J. Keleher, T. Zhang, D. Shipp, S. Hellring, Reactive Pads for Metal CMP, PAC-RIM, November 17-18, 2005, Seoul, Korea
    eAbrasives for CMP Applications, Intel, San Jose, CA, 10/4/05.
  12. Y. Li, J. Keleher, T. Zhang, S. Hellring, Reactive Pads for Metal CMP, 22nd International VLSI/ULSI Multilevel Interconnection, Fremont, California, October 3 - 6, 2005.
  13. Y. Li, Use of Organic Abrasive Particles for Metal CMP, Intel, Hudson, MA, 9/29/05.
  14. Y. Li, J. Keleher, T. Zhang, D. Shipp, and S. Hellring, Reactive Pads for Metal CMP, 10 th International CMP Symposium, Lake Placid, NY, 8/15/05.
  15. Y. Li, CMP Consumable Development, Samsung Electronics, Seoul, Korea, 3/20/05.
  16. J. Zhao, D. Bundi, H. Li, N. Wang, and Y. Li, Self-assembly of Functional Moieties onto Abrasive Particles for Copper CMP slurry Development, SEMICON China, Shanghai, China, 3/17/05.

Total List of Presentations

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Last updated: 11/30/2007 20:24:43 -0500