Laboratory for Advanced Surface Planarization (LASP)

     
 

Invited Lectures

Selected Lectures

  1. A study of Vesicle (Liposome) Formation,DuPont Pharmaceutricals, N.Billerica, MA 1/11/00.
  2. Hydroxyl Radical Formation and Copper Line Corrosion in Cu-CMP, Ferro Penn Yan, NY 4/14/00.
  3. Characterization of Polymer Stabilized Vesicles, 9th IUPAC on Polymer Technology, Tianjin, PR China 6/25/00.
  4. Diamond Particles for Copper Chemical Mechanical Polishing (Cu-CMP), GE-CRD Schenectady, NY 6/30/00.
  5. Nanosize Diamond Particles for Copper CMP, SEMATECH Review, San Diego, CA, 10/1/00.
  6. Resin Particles for Copper Chemical Mechanical Polishing (Cu-CMP) and Ni-P Memory Disc Polishing, Neste Toronto, Canada 10/17/00.
  7. Smart Particles for Chemical Mechanical Polishing in Microelectronic Industry, PPG, Pittsburgh Pa 10/25/00.
  8. Supramolecular Approach to Chemical Mechanical Polishing in Microelectronic Industry, Seagate, Minneapolis, MN 10/26/00.
  9. Read/Write Head CMP, Seagate Technology Inc. Minneapolis MN 10/27/00.
  10. Dynamic NMR, Eastern Analytical Symposium 11/1/00.
  11. Characterization of Solid Particles, Eastern Analytical Symposium 11/2/00.
  12. Reduction of Metal Dishing During Read/Write Head Lapping, Seagate University Research Conclave 12/11/00.
  13. Some Chemical Aspects of CMP, Rodel, Wilmington, DE 12/13/00.
  14. Chemical and Supramolecular Approaches to Read/Write Head Lapping, 1/25/01.
  15. Defectivity Reduction in Cu CMP, Intel, Santa Clara, CA, 4/27/01.
  16. Defectivity Reduction in Cu CMP, Honeywell, Santa Clara, CA, 4/26/01.
  17. Nanomachining of Thin Films Read/Write Heads, CAMP Annual Technical Meeting, Saratoga Spring, NY, 5/16/01.
  18. Novel Low k Materials, PPG Industries, Pittsburgh, PA. 6/15/01.
  19. Novel Liposome Systems for Pharmaceutical Applications, DuPont Pharmaceuticals, N. Billerica, MA, 07/12/01.
  20. Surface Defectivity Reduction in Chemical Mechanical Planarization, Nankai University, Tianjin, PR China, 8/2/01.
  21. Y. Li, J. Zhao, G. Bian, and K. Tang, Characterization of Phenolic Resin Dispersions Formed via in situ Polymerization/Emulsification, 222th National Meeting of the American Chemical Society, Chicago, 8/26-30/01.
  22. Surface Defectivity Reduction in Chemical Mechanical Planarization, Clarkson University, Potsdam, NY 9/6/01.
  23. Characterization of Pharmaceutical Solids Using Various Particle Sizing Techniques, Eastern Analytical Symposium, Atlantic City, NJ, 10/3/01.
  24. Micro-gas Bubbles for Pharmaceutical Applications, Center for Advanced Materials Processing Conference, Clarkson University, Potsdam, NY, 10/18/01.
  25. Y. Li, M. Wang, and J. Zhao, Deposition of Biofilms on “Self-Clean” Surfaces Deposition Symposium Cincinnati OH, November 6, 2001.
  26. Photochemical Funcationalization of Semiconductor Particles Clarkson University, Potsdam, NY, November 8, 2001.
  27. Challenges and Opportunities in Cu CMP, PPG Industries, Monroeville, PA, December 10, 2001.
  28. Y. Li, and J. Zhao, Ultrasound Activatable Gas Shell Assembly for Targeted Drug Delivery, 6th US-Japan Syposium on Drug Delivery Systems,” Lahaina, Hawaii, December 16-21, 2001
  29. Abrasive Free Systems for Copper CMP, SACHEM, Austin, TX, February 18, 2002.
  30. Y. Li, X. Shi, J. Keleher, Chemical and Mechanical Balance for Defectivity Reduction in Copper CMP, MRS Spring 2002 Meeting, San Francisco, CA, April 1-5, 2002.
  31. Y. Li, Characterization of Pharmaceutical Solids Using Various Particle Sizing Techniques, Wyeth Pharmaceuticals, Rouses Point, NY April 12, 2002.
  32. Y. LI, G. Slack, N. Heldt, M. Gauger, Characterization of Polymer Stabilized Liposome Systems, Particle 2002 Orlando, FL, April 20-23.
  33. Y. Li, M. Wang, J. Keleher, J. Brashant, and J. Zhao, Nanomaterials for self-clean surface, CAMP Annual Technical Meeting, Saratoga Spring, NY, 5/15/02.
  34. Characterization and Synthesis of Stable Nano-Bubbles, Bristol-Myers Squibb, N. Billerica, MA, 7/9/02.
  35. Challenges and Opportunities in Copper CMP, Tianjin University, P.R. China, 7/30/02.
  36. Surface active photoinitiators for microe,mulsion plymerization, PPG Industries, Monroeville, PA, 10/1/02.
  37. Synthesis and Characterization of Conventional and Polymer Stabilized Liposomes, University of Alaska Fairbanks, Fairbanks, AK, 10/3/02.
  38. Applications of semiconductor particles in CMP waste treatment and STI Polishing, Fujimi of America, Portland OR, 12/12/02.
  39. Supramolecular Design of an Abrasive CMP System for Cu/Low K Integration, Intel, Portland OR, 12/13/02.

Total list of Lectures

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Last updated: 11/30/2007 20:25:19 -0500