EE441/EE541  Electronic Devices for IC Simulation

Course Outline, Spring 2009

Class web site: http://www.clarkson.edu/~mcheng/EE441-541/EE441_541.html

 

Catalog Data:  EE441 Electronic Devices for IC Simulation, 3 credits

                          Prerequisites: ES260 & EE341

Study of modern electronic devices, including p-n junctions, bipolar junction transistors (BJTs) and metal-oxide-semiconductor field-effect transistors (MOSFETs), for integrated circuit applications.  SPICE device models are introduced, and several SPICE simulation projects are given for integrated circuit analysis.  This course provides a foundation for understanding SPICE device models and the basics of the microelectronic technology.

 

Instructor:      Ming-Cheng Cheng

Office: 138 CAMP, Phone: 268-7735; Email: mcheng@clarkson.edu

Tentative Office Hours:        2:15-3:30pm, Tuesday

                                                2:30-4:00pm, Wednesday

 

Class Schedule and Location:  4:00pm-5:15pm, Tuesday & Thursday, CB268

 

Textbook:      H. Craig Casey, Jr, Devices for Integrated Circuits, John Wiley & Son, 1999.

 

References:   Sheng S. Li, Semiconductor Physical Electronics, New York, Plenum Press

G. W. Neudeck, The PN Junction Diode, Addison-Wesley

G. W. Neudeck, The Bipolar Junction Transistor, Addison-Wesley

R. F. Pierret, Field Effect Devices, Addison-Wesley, 1984.

S. M. Sze, Physics of Semiconductor Devices, 2nd edition, John Wiley & Sons

 

SPICE Tool:   Any SPICE tool can be used for the projects, such as LTSpice (http://cmosedu.com/cmos1/ltspice/ltspice.htm, AIM-Spice (www.aimspice.com) or PSpice (https://www.cadence.com/products/orcad/pages/downloads.aspx).   

 

Course Contents:

Chapter 2   Electrons in Solids

Crystal, energy band for electrons and holes, carrier distribution function, Fermi level, and density of states.

Chapter 3   Carrier Transport & Recombination

Carrier concentration, mobility, drift and diffusion processes, recombination, and basic semiconductor equations

Chapter 4   p-n Junctions: I-V Behavior

Energy band diagram, depletion approximation, pn junction electrostatics, pn junction characteristics,

Chapter 5   p-n Junctions: Reverse Breakdown & Junction Capacitance (a short Spice project will be assigned)

Junction breakdown, depletion and diffusion capacitances, and SPICE diode model.

Chapter 7   MOS Capacitors

Flat band voltage, MOS capacitance, accumulation and inversion, and threshold condition and voltage

Chapter 8   MOS Field Effect Transistors (a short Spice project will be assigned)

IV characteristics, small signal model, basic MOSFET SPICE model

Chapter 9   Bipolar Transistors (a short Spice Project will be assigned)

BJT operation, minority carrier injection, current gain and IV characteristics, Ebers-Moll model, small signal model, basic BJT SPICE model

 

 

Homework Assignments and Projects

There will be approximately 5-6 homework assignments and 3 Spice Projects for this class. Extra problems for graduate students will be included in some homework assignments. The final project for graduate students requires a formal project report and present. 

 

Tentative Date for the First Midterm Exam:  Tuesday, October 6, 2009

Tentative Date for the Second Midterm Exam:  Thursday, November 19, 2007

 

Grade Policy:

Graduate Students (EE541)

Undergraduate students (EE441)

HW Assignments

10%

HW Assignments

15%

Two Midterm Exams

2´20%

Two Midterm Exams

2´22.5%

3 Spice Projects

24%

3 Spice Projects

40%

Final Project & Presentation

26%

 

 

Total

100%

Total

100%

 

* If the student does not turn in any HW assignment or any project, he or she will receive an F grade.

 

 

Exam Policy:

Closed book; only one sheet of notes for equations is allowed.

 

 

Course Learning Outcomes:

  1. Students will understand basic concepts of semiconductor fundamentals and the drift-diffusion transport model.
  2. Students will be able to apply the device models to analyze the basic functions for non-linear devices, including p-n junctions, BJTs and MOSFETs.
  3. Students will be able to calculate and analyze the SPICE device parameters for diodes, BJTs and MOSFETs, and to apply the models of the parameters to circuit simulation in SPICE.
  4. Student will demonstrate their ability to modify and design device parameters, by changing device geometry and/or doping profiles, to improve device/circuit performance.