ES 260: Materials Science and Engineering I: Fall 2012
Catalog Info: The effects of bonding (ionic, covalent, metallic), microstructure (crystalline or amorphous), and defects (vacancies, dislocations, precipitates or voids) on the engineering properties of solids. Course coverage includes crystal structure, solid-state diffusion, phase equilibrium, phase transformation in crystalline solids, mechanical, and electrical properties of crystalline solids are emphasized.
Prerequisites: PH 131, CM 103 or 131, MA132 or consent of the instructor.
Textbook: No textbook is required. Materials from the textbook below are available online:
Fundamentals of Materials Science and Engineering/An Integrated Approach; William D. Callister, Jr. and David G. Rethwisch; 3rd Ed.; John Wiley &Sons.
The materials from this text, including graphics, are available online at www.wileyplus.com. One you register (for a fee) for WileyPlus, you will be able to access course materials, including online homework assignments. These will be graded online automatically by the WileyPlus system. To sign up for WileyPlus, go to:
Instructor: Ian I. Suni, Professor of Chemical and Biomolecular Engineering
Office: CA 2202 Tel: 268-4471
Email: firstname.lastname@example.org Office Hrs: TWTh 9:40-11:00
Class: Section 03 Tues. & Thurs. 1:00 – 2:15 PM CAMP 176
Topical Outline: Introduction: Chapter 1.
Home Work (must be submitted online by due date) 6%
FINAL: Cumulative 28%
Note: Students are required to attend class. All exams are closed book & notes and are given in class at the usual time and place. Students are allowed to bring one hand written sheet (8.5”x11”) of information (both sides). All three of these written sheets can be saved and brought to the final exam. The first three in class exams will have both problem solving and multiple-choice questions; the final exam will have only multiple-choice questions.
Missing an exam will result in ZERO for that exam unless there is a valid excuse with documentation. In that case, the scores on subsequent exams will be more heavily weighted. No make-up exams will be given for any reason whatsoever. No exams will be given in advance, for any reason whatsoever.
Homework Assignments will be assigned and graded online using the WileyPlus system. The teaching assistant (TA) for this course will hold regular office hours to provide some assistance with practice problems, but not with the homework problems. The homework assignments are due September 6, 13, and 20; October 9, 16, and 23; and November 6, 13, and 20.
1. Apply the concepts of crystal structure, including defect structures, to solving materials problems.
2. Apply knowledge of solid-state diffusion to solve materials processing problems.
3. Explain the mechanical properties of materials under one-time, constant, and cyclical stresses.
4. Relate a material’s thermal properties to its atomic bonding and three-dimensional structure.
5. Relate failure of a material to the type of stress and to the mechanical properties and/or crystal structure of the material.
6. Explain the meaning of equilibrium phase diagrams of metals and ceramics.
7. Explain the relationship between a material’s atomic bonding and three-dimensional crystal structure and its electrical properties.
8. Be able to determine the electrical properties of a semiconductor as a function of dopant concentration, dopant type, bandgap, and temperature.
Course Outcomes (Primarily ABET outcomes a and e. Others are covered more informally and are difficult to quantify.)
1. Given the crystal structure and other necessary information for a particular metal, semiconductor, or ceramic material, students will be able to determine the density and x-ray diffraction pattern, as well as the planar atomic densities and linear atomic densities along particular planes and directions.
2. Students will be able to solve numerical problems involving steady and unsteady state diffusion in crystalline solids.
3. Given the stress-strain curve for a material, students will be able to determine the modulus of elasticity, yield strength, tensile strength, and ductility
4. Students will be able to explain the relationship between a material’s thermal properties and its atomic bonding and three-dimensional structure.
5. Students will be able to explain the failure of materials by fracture, fatigue, and creep.
6. For an equilibrium phase diagram, students will be able to determine the composition and the mass fraction of each phase and each microstructure present.
7. Given the needed information, students will be able to calculate electrical properties, such as conductivity and capacitance, of a given material.
8. Students will be able to determine the conductivity of an intrinsic or extrinsic semiconductor for any doping level and temperature.