ES 464/ES 564: Electrochemical and Corrosion Engineering
Catalog Data: ES
464/ES 564 Electrochemical and
Corrosion Engineering.
Quantitative
understanding of the kinetics and thermodynamics of electrochemical reactions. Commercial
applications of electrochemistry in the fields of microelectronic circuit
fabrication, biotechnology, and alternative energy. The nature of corrosion,
how it relates to the fundamentals of electrochemistry, and the means by which
it can be controlled by allow selection, cathodic
protection, and protective coatings.
Prerequisites: CM 132.
Textbooks: Allen J. Bard and Larry R. Faulkner,
Electrochemical Methods, Fundamentals and Applications, 2nd ed. (
Denny A. Jones, Principles and Prevention of Corrosion, 2nd ed. (Upper Saddle River, NJ, Prentice Hall, 1996).
You should also investigate the Interconnect chapter from the following sites:
http://www.itrs.net/Links/2009ITRS/2009Chapters_2009Tables/2009_ExecSum.pdf
http://www.itrs.net/Links/2009ITRS/2009Chapters_2009Tables/2009_Interconnect.pdf
http://www.itrs.net/Links/2010ITRS/IRC-ITRS-MtM-v2%203.pdf
The International Technology Roadmap for Semiconductors (ITRS) is published by the (SIA) Semiconductor Industry Association (www.semichips.org), a consortium of semiconductor companies. The ITRS provides research and development guidelines for people working in both industry and academia to ensure that future technological challenges can be met. Electrochemistry is used for Interconnect fabrication by Cu electrodeposition. In addition, Cu and Ta chemical mechanical planarization (CMP) are both essentially controlled corrosion processes.
Class Time: TTh 8:00-9:15, SC 320.
Instructor: Ian Suni (CAMP 236, x4471, isuni@clarkson.edu)
Office hours: MW, 9:00-11:30
Course site: www.clarkson.edu/~isuni/course464.htm
Topical Outline:
Introduction Examples from Prof. Suni’s laboratory
Potentials and Thermodynamics of Cells: Chapter 2, Bard and Faulkner
Kinetics of Electrode Reactions: Chapter 3, Bard and Faulkner
Mass Transfer by Migration and Diffusion: Chapter 4, Bard and Faulkner
Basic Potential Step Methods: Chapter 5, Bard and Faulkner
Potential Sweep Methods: Chapter 6, Bard and Faulkner
Methods Involving Forced Convection: Chapter 9, Bard and Faulkner
Techniques Based on Concepts of Impedance: Chapter 10, Bard and Faulkner
Case study: Cu
Electrodeposition into Deep Submicron Interconnects
Case study: Water Electrolysis
The Technology and Evaluation of Corrosion: Chapter 1, Jones
Pourbaix Diagrams Chapter 2.2, Jones
Mixed Potential Theory Chapter 3.3, Jones
Passivity Chapter 4, Jones
Polarization Methods to Measure Corrosion Rate: Chapter 5, Jones
Galvanic and Concentration Cell Corrosion Chapter 6, Jones
Pitting and Crevice Corrosion Chapter 7, Jones
Atmospheric Corrosion and Elevated Temperature Oxidation:
Chapter 12, Jones
Cathodic Protection: Chapter 13, Jones
Coatings and Inhibitors: Chapter 14, Jones
Case study: Cu
and Ta Planarization Methods for Deep Submicron Interconnects
Case study: Corrosion in Extreme Environments
Evaluation Methods:
Homework will be assigned but not collected and graded. Grades will be distributed based on z-scores, which measures the number of standard deviations students perform above or below the means:

Midterm examination 25%
Final examination 25%
Research paper 25%
Exam Policy: Open book and notes, no make-up exams.