My research advisor is Prof. Dipankar Roy. Primary research is based on applying fundamental techniques in analyzing surface reactions between solid liquid interfaces. Our research group is working on many fields listed below.

  
  • Chemical Mechanical Planarization (CMP) and Electrochemical Mechanical Planarization (ECMP)
    CMP is currently the most commonly used planarization technique [1-3]. As its name indicates, CMP combines chemical surface reactions with mechanical planarization. CMP of metals includes one or all of the following chemical steps: (i) Chemical dissolution of the surface layer(s); (ii) Oxidation of the surface, with subsequent mechanical abrasion of the porous (mechanically unstable) oxide layers; (ii) Formation of soluble surface complexes that can be dissolved in the polishing solution, or can be removed with . . . . (more)
 
 
   
 
  Refereed publications (Direct journel links may work only if u have subscription)  
 

  1. "Voltage pulse-modulated electrochemical removal of copper surface layers using citric acid as a complexing agent"
    P.C. Goonetilleke, D. Roy , Materials Letters 61, (2007) 380-383.

  2. "Combining impedance spectroscopy with cyclic voltammetry: Measurement and analysis of kinetic parameters for faradaic and nonfaradaic reactions on thin-film gold"
    C.M. Pettit, P.C. Goonetilleke, C.M. Sulyma and D. Roy, Analytical Chemistry 78, (2006) 3723-3729.

  3. "Measurement of differential capacitance for faradaic systems under potentiodynamic conditions: Considerations of Fourier transform and phase-selective techniques"
    C.M. Pettit, P.C. Goonetilleke and D. Roy, Journal of Electroanalytical Chemistry     589, (2006), 219-231.

  4. "Electrochemical-mechanical planarization of copper: Effects of chemical additives on voltage controlled removal of surface layers in electrolytes"
    P.C. Goonetilleke and D. Roy, Materials Chemistry and Physics 94 (2005) 388-400.

  5. "Voltage-Induced Material Removal for Electrochemical Mechanical Planarization of Copper in Electrolytes Containing NO3-, Glycine, and H2O2"
    P. C. Goonetilleke, S. V. Babu, and D. Roy, Electrochemistry and Solid-State Letters 8, (2005) G190-193.

  6. "Relative roles of acetic acid, dodecyl sulfate and benzotriazole in chemical mechanical and electrochemical mechanical planarization of copper"
    P.C. Goonetilleke and D. Roy, Applied Surface Science 254 (2008) 2696-2707.

few of them are already cited by other authors (outside Clarkson)

 
 
 
   Conferences , Posters and Seminars  
 
  1. Surya Sekhar Moganty, Pubudu Goonetilleke, Ruth Baltus and Dipankar Roy, “Electrochemical Characteristics of Ionic Liquid at the Porous Surface of a Paper Electrode of Multiwall Carbon Nanotubes”, Conference paper accepted to be presented at American Institute of Chemical Engineers (AIChE) Annual Meeting, 2008

  2. Surya Sekhar Moganty, Joshua Close, Pubudu Goonetilleke, Sitaraman Krishnan, Ruth Baltus and Dipankar Roy, “Electrochemical Supercapacitors Based on Polymerizable Ionic Liquids”,Conference paper accepted to be presented at American Institute of Chemical Engineers (AIChE) Annual Meeting, 2008

  3. P.C. Goonetilleke, “Electrochemical characterization of Li Ion Battery Materials”, Talk presented at MetaMateria Partners, Columbus, OH, May 18, 2008

  4. P.C. Goonetilleke, S. Sengupta,b T. Pyles, R. R. Revur, A. Tiruvannamalaib and D. Roy, “Electrochemical studies of Nanomaterials for Advanced Lithium-Ion Batteries”, Poster presented at the CAMP Technical Meeting, Canandaigua, NY, May 15-17, 2008.  – Awarded 2nd in place for the most creative poster

  5. P.C. Gonnetilleke, S. S. Moganty, R. E. Baltus and D. Roy, “Electrochemical Characteristics of Hmim-Tf2N Ionic Liquid at the Porous Surface of a Paper Electrode of Multiwall Carbon Nanotubes”, Poster presented at the CAMP Technical Meeting, Canandaigua, NY, May 15-17, 2008.  – Awarded 1st in place for the most attractive poster

  6. S. S. Moganty, P.C. Gonnetilleke, R. E. Baltus and D. Roy, “Electrochemical Supercapacitors Based on Ionic Liquids”, Poster presented at the CAMP Technical Meeting, Canandaigua, NY, May 15-17, 2008

  7. S.S. Moganty, R. E. Baltus, P.C. Goonetilleke and D. Roy, “Physicochemical Characterization   of Ionic Liquids”, Conference paper presented at the American Institute of Chemical Engineers (AIChE) Annual Meeting, Salt Lake City, Utah, Nov. 4-9, 2007

  8. P.C. Goonetilleke, C. Sulyma, G. Zenger, S. Sengupta, T. Pyles, R. R. Revur, and D. Roy , “Electrochemical Characterization of Advanced Nanomaterials for Next Generation Lithium-Ion Batteries”, Poster presented at CAMP Technical Meeting, October 15-17, 2007, Potsdam, NY

  9. P.C. Goonetilleke and D. Roy, “Dodecyl Sulfate as a Corrosion Inhibitor and Acetic Acid as a Complexing Agent for Electrochemical Mechanical Planarization of Copper”, Poster presented at the CAMP Technical Meeting, Canandaigua, NY, May 16-18, 2007

  10. P.C. Goonetilleke, D. Roy, “Material Removal Efficiency of an Alkaline Electrolyte for ECMP of Ruthenium”, Poster presented at the CAMP Technical Meeting, Canandaigua, NY, May 16-18, 2007

  11. C. M. Sulyma, P.C. Goonetilleke and D. Roy, “Analysis of Current Transients for Voltage Modulated ECMP of Copper”, Poster presented at the CAMP Technical Meeting, Canandaigua, NY, May 16-18, 2007

  13. P.C. Goonetilleke and D. Roy, “Material Removal for ECMP of Ruthenium”, Poster presented at CAMP Technical Meeting, Potsdam, NY, October 18-20, 2006

  14. C.M. Sulyma, P.C. Goonetilleke and D. Roy, “Analysis of Current Transients for Pulse-Modulated ECMP of Copper”, Poster presented at CAMP Technical Meeting, Potsdam, NY, October 18-20, 2006

  15. C.M. Sulyma, P.C. Goonetilleke and D. Roy, “Analysis of Current Transients for Voltage Pulse-Modulated Electrochemical Mechanical Planarization (ECMP) of Copper”, Poster presented at the 11th International Symposium on Chemical Mechanical Planarization, Lake Placid, NY, August 13-16, 2006

  16. P.C. Goonetilleke and D. Roy, “Material Removal Efficiency of an Alkaline Electrolyte for Electrochemical-Mechanical Planarization (ECMP) of Ruthenium”, Poster presented at the 11th International Symposium on Chemical Mechanical Planarization, Lake Placid, NY, August 13-16, 2006

  17. P.C. Goonetilleke, “Electrochemical and optical characterization of material interfaces for applications in planarization and sensor technologies”, Thesis proposal at Department of Physics, Clarkson University, NY, May 2, 2006

  18. P.C. Goonetilleke, “The Faradaic Efficiency of Material Removal in Voltage Pulse Modulated Electrochemical Mechanical Planarization of Copper”, Colloquium at Department of Physics, Clarkson University, NY, January 13, 2006

  19. P.C. Goonetilleke and D. Roy, “Examination of Dodecyl Sulphate as a Corrosion Inhibitor and Acetic Acid as a Complexing Agent for Electrochemical-Mechanical Planarization of Copper”, Poster presented at the 11th International Symposium on Chemical Mechanical Planarization, Lake Placid, NY, August 14-17, 2005

  20. P.C. Goonetilleke and D. Roy, “Faradaic Efficiency of Glycine-Hydrogen Peroxide Solutions in Electrochemical-Mechanical Planarization (ECMP) of Cu”, Poster presented at the 10th International Symposium on Chemical Mechanical Planarization, Lake Placid, NY, August 14-17, 2005

  21. S.V. Babu, S. Pandija, Y. Hong, P.C. Goonetilleke, D. Roy, “Complexing Agents and Surfactants in CMP and ECMP of Copper”, Talk presented at the 10th International Symposium on Chemical Mechanical Planarization, Lake Placid, NY, August 14-17, 2005

  22. P.C. Goonetilleke, “ECMP of Copper for Microchip Fabrication”, Colloquium at Department of Physics, Clarkson University, NY, February 4, 2005

  
 

 
 
 

 
Designed by Pubudu Goonetilleke 2005